Junping Yi
English中文

The AI Infrastructure & Semiconductor Investment Atlas

A map of the AI economy from models and accelerators to power, data centers, manufacturing geography, and investable exposure.

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Package → rack → facility → grid

What this book connects

The atlas follows economic value through the full physical stack. It connects a model workload to chips, memory, packaging, networks, data-center power, manufacturing capacity, national policy, and the public or private entities exposed to each constraint.

Chip-to-grid anatomy from accelerator package through data center and electrical grid

Read the atlas

Orientation

Orientation

  1. →How to use this atlas

Part I

The Argument

  1. →The argument

Part II

The Stack

  1. 2.1Models & the intelligence frontier
  2. 2.2Applications & monetization
  3. 2.3Power & data centers
  4. 2.4Cloud & the software moat
  5. 2.5AI chips & accelerators
  6. 2.6Interconnect & networking
  7. 2.7Memory & advanced packaging
  8. 2.8Foundry & fabrication
  9. 2.9Equipment & EDA
  10. 2.10Materials & inputs
  11. 2.11Capital & market structure
  12. 2.12Geopolitics, policy & risk
  13. 2.13From GPU to AI factory

Part III

Systems in the Round

  1. →The U.S., China, and allied chokepoints

Part IV

Where It Is Going

  1. →Where the constraint migrates next

Part V

Investment Decision Layer

  1. →From strategic map to investable exposure

Part VI

Reference

  1. →Methods, sources & definitions

Choose a reading path

InvestorFrom strategic map to investable exposureOperatorFrom package and rack to the 100 MW facilityPolicy readerGeopolitics, controls, and two diverging stacks